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2019深圳国际半导体制造展 Semicon China 2019 Shenzhen

发布者: Gary易 | 发布时间: 2018-11-14 18:30| 查看数: 95| 评论数: 0|帖子模式

2019深圳国际半导体制造展
Semicon China 2019 Shenzhen
2019年6月14-16日   深圳会展中心
June 14-16, 2019 Shenzhen Convention and Exhibition Center
主办单位:
Sponsored by:
中国通信工业协会
China Communications Industry Association
深圳市中瑞展览有限公司
Shenzhen Zhongrui Convention & Exhibition Co., Ltd.
承办单位:
Organized by:
深圳市中瑞展览有限公司
Shenzhen Zhongrui Convention & Exhibition Co., Ltd.
深圳市中新材会展有限公司
Shenzhen Zhongxincai Convention & Exhibition Co., Ltd.

鸣谢单位:
Acknowledgement:
中国通信工业协会物联网分会
China Communications Industry Association, Internet of Things Branch
中国电子元器件行业协会
China Electronic Components Industry Association
中国光学光电子行业协会
China Optics and Optoelectronics Manufactures Association
台湾电子设备协会
Taiwan Electronic Equipment Industry Association

展示范围:
Exhibition scope:
半导体设计、封测、制造产厂商
Semiconductor design, packaging and testing, manufacturing companies
原材料
Raw materials
-----硅晶圆、光刻胶、光掩膜版、特种气体、CMP抛光材料、湿电子化学品、溅射靶材、封测材料;
-----Silicon wafers, photoresists, photomasks, special gases, CMP polishing materials, wet electronic chemicals, sputtering targets, packaging and testing materials;
生产设备
Production equipment
-----单晶炉、氧化炉、扩散设备、离子注入设备、PVD、CVD 、光刻机 、 蚀刻机 、抛光机、倒角机、涂胶/显影机、前道测试设备、湿制程设备、热加工、涂布设备 、单晶片沉积系统、清洗设备;
-----Single crystal furnaces, oxidation furnaces, diffusion equipment, ion implantation equipment, PVD, CVD, lithography machines, etching machines, polishing machines, chamfering machines, gluing/developing machines, front-end test equipment, wet process equipment, thermal processing and coating equipment, single wafer deposition systems, cleaning equipment;
封装工艺
Packaging process
------减薄机、划片机、贴片机 焊线机、塑封机、打弯设备、分选机、测试机、 研磨液  划片液 封片膜(胶) 高温胶带; 其他材料和设备等
------Thinning machines, dicing machine, chip mounters, wire bonders, laminating machines, bending equipment, sorting machines, testing machines, grinding fluid, dicing solutions, sealing film (glue), high temperature tapes; other materials and equipment.

上届回顾:
Review of the previous exposition:
2019深圳国际半导体制造展览会暨第三届深圳国际手机3C智造展(Smart Factory 2018)于2018年6月21-23日在深圳会展中心2、3、4号馆成功举办。展出面积40000平米。503家展商展在2、3、4号等馆展出技术设备和解决方案。 展会为期3天、以半导体、3C智造、手机自动化、传感器等领域的企业精彩亮相。同期举办多场技术峰会。
Semicon China 2019 Shenzhen and the 3rd Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition (Smart Factory 2018) were successfully held during June 21-23, 2018 in Pavilion 2, 3 and 4 of Shenzhen Convention and Exhibition Center. The exhibition area was 40,000 square meters. 503 exhibitors exhibited their technical equipment and solutions in Pavilion 2, 3 and 4. The exhibition lasted 3 days, featuring the providers of semiconductors, 3C smart manufacturing, mobile phone automation, sensors, etc. Several technical summits were held during the same period.
本届展会展出面积近5万平米同期举办第四届深圳国际手机3C智造展、预计超过5万名专业观众。
With an exhibition area of nearly 50,000 square meters, it is expected to attract more than 50,000 professional visitors, and the 4th Shenzhen International Mobile Phone 3C Smart Manufacturing Exposition will be held concurrently.

如欲了解更多展相关资料,请来电咨询:
For more information about Sensor Shenzhen 2019, please call us:
中瑞会展/中新材会展
Zhongrui Convention & Exhibition/ Zhongxincai Convention & Exhibition
TEL: +86-755-33375577
Mobile: 13538282680  E-mail:935667441@qq.com
联系人:易齐
或登录: www.sz-semiconductor.com

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